Canteliver Probe Card
MPI Cantilever Probe Card is extensively used on gold bump and pad wafer testing for Screen driver, logic, and memory machine. MPI’s cantilever probes tend to be the corresponding solution for the calls for of fine pitch, compact pad size, large pace, fewer cleansing, multi-DUT, high pin count, and ultra-reduced leakage needs. With fantastic craftsmanship, innovative architecture and confirmed methodologies depending on mechanical and electrical simulation/measurement final results, generating MPI the very best cantilever supplier around the world.
FCB Probe Card
The FCB Probe Card is considered the most mature engineering of buckling beam probe card. It truly is aimed to realize the semiconductor ship manufacture time-to-industry (TTM) and cost of check (COT) demand. FCB is a proven Alternative for several different semiconductor output assessments from early engineering pilot-runs to high quantity production (HVM). FCB is ready for device demanding substantial signal integrity probing (SI) and/or power integrity probing (PI). Purposes include things like reducing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and much more. FCB assures the globe’s greatest General Price tag-of-ownership (COO) for various DUT purposes.
EVS Probe Card
The EVS Probe Card is surely an improvement in excess of the conventional buckling beam probe card. Vital capabilities are greater present-day carrying capability (C.C.C.) and lessen balanced Call power (BCF), as well as Over-all MEMS-like traits. EVS can certainly meet the prerequisite of advanced wafer probing. read more Exact alignment and excellent planarity Management are the essential factors contributing to steady Call resistance. With its capacity and functionality, EVS Probe Card is an ideal choice for Sophisticated probe playing cards.
Osprey probe card
The Osprey probe card is MPI’s Alternative to demand for ever finer pitch. It can be suitable for smaller sized Al pad, and is also perfect for little pitch software with peripheral and full array pattern. With precise alignment and greater planarity Regulate, Osprey can reach greater productivity by multi-DUT layout. The forming wire (FW) form needle manufactured with MPI’s own micro fabrication procedure not just delivers large-good quality effectiveness and also will allow quick needle substitution and shortens protecting cycle time.
Kestrel Probe Card
The Kestrel Probe Card is provided with MEMS wire (MW) needle which happens to be suitable for the demand from customers of very low pressure probing. What's more, it includes the chance to satisfy high C.C.C. and high pin counts software. The MEMS course of action makes certain hugely regular needle qualities, as well as the Unique structure design permits exact alignment and planarity Manage.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/
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